강조하다: 
                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                PCB laser depaneling machine, FPC UV laser depanelizer, high precision PCB laser cutter
                              

무게:	1600KG	레이저 브랜드:	옵투웨이브
레이저 파워:	10W	레이저 파장:	355 nm
전원공급장치:	교류 220V	재료 두께:	1.2mm 이하
절단 정밀도:	±20 μm	플랫폼 정밀도:	±2 μm
작업 영역:	600*450 mm	최대 출력:	3KW
빔 직경:	20±5μm	주변 온도:	20±2℃
주변 습도:	<60%	기계 재료:	대리석
치수:	1480mm1360mm1412 밀리미터

무게:	1600KG
레이저 브랜드:	옵투웨이브
레이저 파워:	10W
레이저 파장:	355 nm
전원공급장치:	교류 220V
재료 두께:	1.2mm 이하
절단 정밀도:	±20 μm
플랫폼 정밀도:	±2 μm
작업 영역:	600*450 mm
최대 출력:	3KW
빔 직경:	20±5μm
주변 온도:	20±2℃
주변 습도:	<60%
기계 재료:	대리석
치수:	1480mm1360mm1412 밀리미터

PCB Laser Depanelizer Machine. FPC UV Laser Depaneizer,High Precision Pcb Laser Cutting Equipment

PCB Laser Depanelizer Machine

FPC UV Laser Depanelizer - High Precision PCB Laser Cutting Equipment

Inline Laser Cutting Machine for Flexible Circuit Boards without Stress

Cutting Applications

FPC and related materials
FPC/PCB/Rigid-Flex PCB cutting
Camera module cutting

Key Features

Fast and efficient operation, reducing delivery time
High quality results with no distortion and clean, uniform surfaces
Integration of CNC technology, laser technology, and software technology
High accuracy and high-speed performance

Advantages of Laser PCB Depaneling/Singulation

No mechanical stress on substrates or circuits
No tooling cost or consumables required
Versatile applications with simple setting changes
Fiducial recognition for precise and clean cuts
Optical recognition before depaneling process begins
Ability to depanel virtually any substrate (Rogers, FR4, ChemA, Teflon, ceramics, aluminum, brass, copper, etc.)
Extraordinary cut quality holding tolerances as small as < 50 microns
No design limitations - ability to cut virtually any size PCB board including complex contours and multidimensional boards

Technical Specifications

Parameter	Specification
Technical Parameters	Main body of laser: 1480mm × 1360mm × 1412mm
Power	AC220 V
Laser Wavelength	355 nm
Laser Source	Optowave 10W (US)
Material Thickness	≤ 1.2 mm
Precision	±20 μm
Platform Accuracy	±2 μm
Working Area	600 × 450 mm
Maximum Power	3 KW
Vibrating Mirror	CTI (US)
Spot Diameter	20 ± 5 μm
Ambient Temperature	20 ± 2 ℃
Ambient Humidity	< 60%
Machine Base	Marble